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  • AIA NAS4123

AIA NAS4123

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

Aerospace Industries Association , 01/31/2024

Publisher: AIA

File Format: PDF

$33.00$66.00


Standard By:Aerospace Industries Association , 01/31/2024
Published:01/31/2024
Pages:16
File Size:1 file , 670 KB

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