ASTM F3147-15

Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)

ASTM International , 06/01/2015

Publisher: ASTM

File Format: PDF

$33.00$66.00

Description

Standard By:ASTM International , 06/01/2015

Published:06/01/2015

Pages:3

File Size:1 file , 130 KB

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

1.1This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility

1.2A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).

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