BS 07/30172404 DC

BS EN 62047-9. Semiconductor devices. Micro-electromechanical devices. Part 9. Wafer to wafer bonding strength measurement for MEMS

BSI Group , 12/05/2007

Publisher: BS

File Format: PDF

$90.00$180.61

Description

Standard By:BSI Group , 12/05/2007

Published:12/05/2007

Pages:11

Cross References:IEC 60068-2-1:1990IEC 60068-2-81:2003IEC 60721-2-1:1982IEC 60721-3-0:1984IEC 60721-3-1:1997 IEC 60747-1:1983IEC 60747-14-1:2000IEC 60749-1:2002ISO/IEC GUIDE 2:2004

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