• BS 08/30175763 DC

BS 08/30175763 DC

BS EN 60191-6-18. Mechanical standardization of semiconductor devices. Part 6-18. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

BSI Group , 01/03/2008

Publisher: BS

File Format: PDF

$134.00$269.46


Cross References:IEC 60191-6:2004

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