BS PD IEC TR 61189-5-506:2019

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

BSI Group , 07/18/2019

Publisher: BS

File Format: PDF

$132.00$264.16

Description

Standard By:BSI Group , 07/18/2019

Published:07/18/2019

Pages:26

ISBN(s):9780539000689

File Size:1 file , 5.1 MB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.Cross References:IEC 60068-2-20:2008IEC 61189-5-501

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