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  • BS PD IEC TR 61760-3-1:2022

BS PD IEC TR 61760-3-1:2022

Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

BSI Group , 10/31/2022

Publisher: BS

File Format: PDF

$132.00$264.00


Standard By:BSI Group , 10/31/2022
Published:10/31/2022
Pages:30
ISBN(s):9780539179361
File Size:1 file , 2.4 MB
Language:English
Note:This product is unavailable in Ukraine, Russia, Belarus

BS PD IEC TR 61760-3-1:2022 PDF

Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

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