BS PD IEC TR 62878-2-7:2019

Device embedding assembly technology-Guidelines. Accelerated stress testing of passive embedded circuit boards

BSI Group , 04/01/2019

Publisher: BS

File Format: PDF

$95.00$190.50

Description

Standard By:BSI Group , 04/01/2019

Published:04/01/2019

Pages:14

ISBN(s):9780539033595

File Size:1 file , 2.5 MB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

BS PD IEC TR 62878-2-7:2019 describes the accelerated stress testing of passive embedded circuitboards. It can be used for screening finished boards, including multilayer and high-densityinterconnection (HDI) boards. These boards are mainly for mobile devices.Cross References:IEC 60194

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