BS PD IEC TR 63378-1:2021

Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

BSI Group , 01/11/2022

Publisher: BS

File Format: PDF

$132.00$264.00

Description

Standard By:BSI Group , 01/11/2022

Published:01/11/2022

Pages:24

ISBN(s):9780539171525

File Size:1 file , 2.4 MB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

BS PD IEC TR 63378-1:2021 PDF

This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

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