IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

International Electrotechnical Commission , 07/28/2017

Publisher: IEC

File Format: PDF

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Standard By:International Electrotechnical Commission , 07/28/2017

Published:07/28/2017

Pages:7

File Size:1 file , 580 KB

Language:English

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