IEC 60191-6-1 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

International Electrotechnical Commission , 10/30/2001

Publisher: IEC

File Format: PDF

$12.00$25.00

Standard By:International Electrotechnical Commission , 10/30/2001

Published:10/30/2001

Pages:7

File Size:1 file , 230 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

$208.00 $417.00

$95.00 $190.00

$117.00 $234.00

$208.00 $417.00