• IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission , 07/28/2010

Publisher: IEC

File Format: PDF

$129.00$259.85


More IEC Standards PDF

IEC 61920 Ed. 2.0 en:2004

IEC 61920 Ed. 2.0 en:2004

$77.00 $154.00

IEC 60793-2-50 Ed. 2.0 b:2004
IEEE 802.11i-2004

IEEE 802.11i-2004

$95.00 $191.00

IEC 60238 Ed. 8.0 b:2004

IEC 60238 Ed. 8.0 b:2004

$125.00 $250.00