• IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission , 07/28/2010

Publisher: IEC

File Format: PDF

$129.00$259.85


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