IEC 60191-6-18 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission , 01/07/2010

Publisher: IEC

File Format: PDF

$72.00$145.00

Description

Standard By:International Electrotechnical Commission , 01/07/2010

Published:01/07/2010

Pages:40

File Size:1 file , 1.1 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

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