• Your shopping cart is empty!

  • IEC 60191-6-2 Ed. 1.0 b:2001

IEC 60191-6-2 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission , 12/11/2001

Publisher: IEC

File Format: PDF

$25.00$51.00


Standard By:International Electrotechnical Commission , 12/11/2001
Published:12/11/2001
Pages:21
File Size:1 file , 250 KB
Language:English, French
Note:This product is unavailable in Ukraine, Russia, Belarus
IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

More IEC Standards PDF

IEEE 493-1997

IEEE 493-1997

$112.00 $224.00

IEC 61675-1 Ed. 1.0 en:1998

IEC 61675-1 Ed. 1.0 en:1998

$79.00 $158.00

IEC 62053-31 Ed. 1.0 b:1998

IEC 62053-31 Ed. 1.0 b:1998

$66.00 $133.00

IEEE 693-1997

IEEE 693-1997

$86.00 $172.00