IEC 60191-6-2 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission , 12/11/2001

Publisher: IEC

File Format: PDF

$31.00$62.00


Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.

More IEC Standards PDF

IEC 61156-4-2 Ed. 1.0 b:2001
IEC 60601-2-12 Ed. 2.0 en:2001
IEC 61156-2-2 Ed. 1.0 b:2001
IEC 60270 Ed. 3.0 b COR. 1:2001