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IEC 60191-6-2 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission , 12/11/2001

Publisher: IEC

File Format: PDF

$31.00$62.00


Standard By:International Electrotechnical Commission , 12/11/2001
Published:12/11/2001
Pages:10
File Size:1 file , 260 KB
Language:English
Note:This product is unavailable in Ukraine, Russia, Belarus
Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.

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