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IEC 60749-14 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

International Electrotechnical Commission , 08/07/2003

Publisher: IEC

File Format: PDF

$47.00$95.00


Standard By:International Electrotechnical Commission , 08/07/2003
Published:08/07/2003
Pages:27
File Size:1 file , 570 KB
Language:English, French
Note:This product is unavailable in Ukraine, Russia, Belarus
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

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