IEC 60749-19 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

International Electrotechnical Commission , 02/13/2003

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 02/13/2003

Published:02/13/2003

Pages:11

File Size:1 file , 200 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

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