IEC 60749-22 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

International Electrotechnical Commission , 09/12/2002

Publisher: IEC

File Format: PDF

$95.00$190.00

Description

Standard By:International Electrotechnical Commission , 09/12/2002

Published:09/12/2002

Pages:41

File Size:1 file , 720 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

More IEC Standards PDF

IEC 60730-2-4 Amd.2 Ed. 1.0 b:2001

$12.00 $25.00

IEC 60839-7-5 Ed. 1.0 b:2001

$12.00 $25.00

IEEE 802.1u-2001

$28.00 $56.00

IEC 60743 Ed. 2.0 b:2001

$89.00 $179.00