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IEC 60749-35 Ed. 1.0 b:2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

International Electrotechnical Commission , 07/18/2006

Publisher: IEC

File Format: PDF

$95.00$190.00


Standard By:International Electrotechnical Commission , 07/18/2006
Published:07/18/2006
Pages:43
File Size:1 file , 1 MB
Language:English, French
Note:This product is unavailable in Ukraine, Russia, Belarus
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

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