IEC 61188-6-4 Ed. 1.0 b:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

International Electrotechnical Commission , 05/02/2019

Publisher: IEC

File Format: PDF

$164.00$329.00

Description

Standard By:International Electrotechnical Commission , 05/02/2019

Published:05/02/2019

Pages:81

File Size:1 file , 4.8 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

More IEC Standards PDF

IEC 62694 Ed. 2.0 b:2022

$139.00 $278.00

IEEE 1017.1-2021

$44.00 $88.00

IEC 60079-5 Ed. 4.1 b:2022

$136.00 $272.00

IEEE 287.2-2021

$30.00 $61.00