IEC 61189-2-804 Ed. 1.0 b:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

International Electrotechnical Commission , 08/01/2023

Publisher: IEC

File Format: PDF

$12.00$25.00

Description

Standard By:International Electrotechnical Commission , 08/01/2023

Published:08/01/2023

Pages:20

ISBN(s):9782832274224

File Size:1 file , 700 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 61189 specifies a test method to determine the time to delamination of base
materials and printed boards using a thermomechanical analyser (TMA). Temperatures used
for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

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