IEC 61189-2-808 Ed. 1.0 b:2024

Test Methods For Electrical Materials, Printed Board And Other Interconnection Structures And Assemblies - Part 2-808: Thermal Resistance Of An Assembly By Thermal Transient Method

International Electrotechnical Commission , 04/01/2024

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 04/01/2024

Published:04/01/2024

Pages:44

ISBN(s):9782832288047

File Size:1 file , 2.7 MB

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IEC 61189-2-808 Ed. 1.0 b:2024 PDF

This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.

NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

IEC 61189-2-808 Ed. 1.0 b:2024

Test Methods For Electrical Materials, Printed Board And Other Interconnection Structures And Assemblies - Part 2-808: Thermal Resistance Of An Assembly By Thermal Transient Method

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