• Your shopping cart is empty!

  • IEC 61189-5-4 Ed. 1.0 b:2015

IEC 61189-5-4 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

International Electrotechnical Commission , 01/08/2015

Publisher: IEC

File Format: PDF

$95.00$190.00


Standard By:International Electrotechnical Commission , 01/08/2015
Published:01/08/2015
Pages:45
File Size:1 file , 500 KB
Language:English, French
Note:This product is unavailable in Ukraine, Russia, Belarus
IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.

More IEC Standards PDF

IEC 60086-1 Ed. 10.0 en:2006

IEC 60086-1 Ed. 10.0 en:2006

$69.00 $139.00

IEC 60335-2-74 Ed. 2.1 b:2006

IEC 60335-2-74 Ed. 2.1 b:2006

$33.00 $66.00

IEC 60601-1-6 Ed. 2.0 b:2006

IEC 60601-1-6 Ed. 2.0 b:2006

$117.00 $235.00

IEC 62230 Ed. 1.0 b:2006

IEC 62230 Ed. 1.0 b:2006

$72.00 $145.00