IEC 61190-1-1 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

International Electrotechnical Commission , 03/25/2002

Publisher: IEC

File Format: PDF

$95.00$190.00

Description

Standard By:International Electrotechnical Commission , 03/25/2002

Published:03/25/2002

Pages:41

File Size:1 file , 570 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

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