IEC 61192-3 Ed. 1.0 b:2002

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

International Electrotechnical Commission , 12/17/2002

Publisher: IEC

File Format: PDF

$140.00$281.00

Description

Standard By:International Electrotechnical Commission , 12/17/2002

Published:12/17/2002

Pages:93

File Size:1 file , 7.3 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

More IEC Standards PDF

ICC IMC-2015 Commentary

$60.00 $120.00

IEC 62489-2 Ed. 2.0 b:2014

$47.00 $95.00

IEC 62149-9 Ed. 1.0 b:2014

$72.00 $145.00

IEC 61910-1 Ed. 1.0 b:2014

$139.00 $278.00