IEC 61192-3 Ed. 1.0 b:2002

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

International Electrotechnical Commission , 12/17/2002

Publisher: IEC

File Format: PDF

$140.00$281.00

Description

Standard By:International Electrotechnical Commission , 12/17/2002

Published:12/17/2002

Pages:93

File Size:1 file , 7.3 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

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