IEC 62047-37 Ed. 1.0 b:2020

Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

International Electrotechnical Commission , 04/28/2020

Publisher: IEC

File Format: PDF

$72.00$145.00


IEC 62047-37:2020 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors.

This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.

More IEC Standards PDF

IEC 60335-2-52 Ed. 3.0 b:2002
IEC 60353 Amd.1 Ed. 2.0 b:2002
IEEE 95-2002

IEEE 95-2002

$63.00 $127.00

IEEE N42.30-2002

IEEE N42.30-2002

$63.00 $126.00