• IEC 62047-9 Ed. 1.0 b COR.1:2012

IEC 62047-9 Ed. 1.0 b COR.1:2012

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

International Electrotechnical Commission , 03/08/2012

Publisher: IEC

File Format: PDF

$107.00$214.12


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