IEC 62418 Ed. 1.0 b:2010

Semiconductor devices - Metallization stress void test

International Electrotechnical Commission , 04/22/2010

Publisher: IEC

File Format: PDF

$72.00$145.00

Description

Standard By:International Electrotechnical Commission , 04/22/2010

Published:04/22/2010

Pages:34

File Size:1 file , 990 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

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