• IEC 62418 Ed. 1.0 b:2010

IEC 62418 Ed. 1.0 b:2010

Semiconductor devices - Metallization stress void test

International Electrotechnical Commission , 04/22/2010

Publisher: IEC

File Format: PDF

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IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

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