IEC 62769-8 Ed. 1.0 b:2023

Field device integration (FDI®) – Part 8: EDD to OPC-UA Mapping

International Electrotechnical Commission , 04/01/2023

Publisher: IEC

File Format: PDF

$183.00$367.00

Description

Standard By:International Electrotechnical Commission , 04/01/2023

Published:04/01/2023

Pages:110

ISBN(s):9782832267929

File Size:1 file , 2.4 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62769 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.

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