• IPC 3408

IPC 3408

General Requirements for Anisotropically Conductive Adhesives Films

Association Connecting Electronics Industries , 11/01/1996

Publisher: IPC

File Format: PDF

$50.00$101.00


This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.

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