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  • IPC 4563

IPC 4563

Resin Coated Copper Foil for Printed Boards Guideline

Association Connecting Electronics Industries , 11/01/2007

Publisher: IPC

File Format: PDF

$50.00$101.00


Standard By:Association Connecting Electronics Industries , 11/01/2007
Published:11/01/2007
Pages:19
File Size:1 file , 270 KB
Language:English
Note:This product is unavailable in Russia, Ukraine, Belarus
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

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