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  • IPC 9502

IPC 9502

PWB Assembly Soldering Process Guideline for Electronic Components

Association Connecting Electronics Industries , 04/01/1999

Publisher: IPC

File Format: PDF

$50.00$101.00


Standard By:Association Connecting Electronics Industries , 04/01/1999
Published:04/01/1999
Pages:12
File Size:1 file , 210 KB
Language:English
Note:This product is unavailable in Russia, Ukraine, Belarus
This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.

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