IPC DD-135

Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

Association Connecting Electronics Industries , 08/01/1995

Publisher: IPC

File Format: PDF

$32.00$65.00

Description

Standard By:Association Connecting Electronics Industries , 08/01/1995

Published:08/01/1995

Pages:36

File Size:1 file , 370 KB

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.

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