• IPC J-STD-027

IPC J-STD-027

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

Association Connecting Electronics Industries , 02/01/2003

Publisher: IPC

File Format: PDF

$50.00$101.00


THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

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