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  • IPC TR-486

IPC TR-486

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Association Connecting Electronics Industries , 07/01/2001

Publisher: IPC

File Format: PDF

$71.00$142.00


Standard By:Association Connecting Electronics Industries , 07/01/2001
Published:07/01/2001
Pages:56
File Size:1 file , 760 KB
Language:English
Note:This product is unavailable in Russia, Ukraine, Belarus
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used.

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