AIA NAS4123

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

Aerospace Industries Association , 03/30/2012

Publisher: AIA

File Format: PDF

$33.00$66.00

Standard By:Aerospace Industries Association , 03/30/2012

Published:03/30/2012

Pages:16

File Size:1 file , 290 KB

Language:English

$33.00 $66.00

$33.00 $66.00

$33.00 $66.00

$33.00 $66.00

$33.00 $66.00

$33.00 $66.00

$33.00 $66.00