BS 3934-5:1992

Mechanical standardization of semiconductor devices-Recommendations for tape automated bonding (TAB) of integrated circuits

BSI Group , 04/01/1992

Publisher: BS

File Format: PDF

$132.00$264.16

Description

Standard By:BSI Group , 04/01/1992

Published:04/01/1992

Pages:16

ISBN(s):058020250X, 058020250

File Size:1 file

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or 'chip carriers'.