BS DD IEC/PAS 62137-3:2008

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

BSI Group , 01/31/2009

Publisher: BS

File Format: PDF

$175.00$350.52

Description

Standard By:BSI Group , 01/31/2009

Published:01/31/2009

Pages:46

ISBN(s):9780580641268

File Size:1 file , 880 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

Cross References:IEC 60068-1:1988IEC 60068-1:1988/AMD 1:1988IEC 60068-2-2:2007IEC 60068-2-14:1984IEC 60068-2-14:1984/AMD 1:1986IEC 60068-2-78:2001IEC 60194:2006IEC 61188-5IEC 61190-1-1:2002IEC 61190-1-2:2007IEC 61249-2-7:2002IEC 62137:2005 IEC 62137-1-1:2007IEC 62137-1-2:2007IEC 62137-1-3IEC 62137-1-4IEC 62137-1-5