BS PD ES 59008-3:1999

Data requirements for semiconductor die-Mechanical, material and connectivity requirements

BSI Group , 12/15/1999

Publisher: BS

File Format: PDF

$80.00$160.02

Description

Standard By:BSI Group , 12/15/1999

Published:12/15/1999

Pages:14

ISBN(s):0580357597

File Size:1 file , 390 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use. To be read in conjunction with PD ES 59008-1Cross References: ES 59008-1*ES 59008-2*ES 59008-4*ES 59008-5*ES 59008-6-1*ES 59008-6-2*IEC 60191 *IEC 61360-1:1995*EIA/JESD30-B*EIA/JEP95*BS 3934*