IEC 60068-2-58 Ed. 3.0 b:2004

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

International Electrotechnical Commission , 07/15/2004

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 07/15/2004

Published:07/15/2004

Pages:53

File Size:1 file , 1.3 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.