IEC 60068-2-69 Ed. 1.0 b:1995

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

International Electrotechnical Commission , 12/08/1995

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 12/08/1995

Published:12/08/1995

Pages:43

File Size:1 file , 2 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.