IEC 60191-4 Ed. 3.1 b:2018

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

International Electrotechnical Commission , 03/27/2018

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 03/27/2018

Published:03/27/2018

Pages:152

File Size:1 file , 2.3 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.