IEC 60191-6-12 Ed. 2.0 b:2011

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

International Electrotechnical Commission , 06/08/2011

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 06/08/2011

Published:06/08/2011

Pages:37

File Size:1 file , 510 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title;
- ball pitch of 0,3 mm has been added;
- datum is changed from the body datum to the ball datum;
- combination lists of D, E, MD, and ME have been revised.