IEC 60191-6-13 Ed. 1.0 en:2007

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

International Electrotechnical Commission , 06/27/2007

Publisher: IEC

File Format: PDF

$38.00$77.00

Description

Standard By:International Electrotechnical Commission , 06/27/2007

Published:06/27/2007

Pages:15

File Size:1 file , 250 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.