IEC 60191-6-6 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

International Electrotechnical Commission , 03/22/2001

Publisher: IEC

File Format: PDF

$47.00$95.00

Description

Standard By:International Electrotechnical Commission , 03/22/2001

Published:03/22/2001

Pages:25

File Size:1 file , 310 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.