IEC 60191-6-8 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

International Electrotechnical Commission , 08/27/2001

Publisher: IEC

File Format: PDF

$25.00$51.00

Description

Standard By:International Electrotechnical Commission , 08/27/2001

Published:08/27/2001

Pages:22

File Size:1 file , 330 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.