IEC 60749-21 Ed. 1.0 b:2004

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

International Electrotechnical Commission , 03/15/2004

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 03/15/2004

Published:03/15/2004

Pages:45

File Size:1 file , 850 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.