IEC 60749-39 Ed. 1.0 b:2006

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

International Electrotechnical Commission , 07/24/2006

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 07/24/2006

Published:07/24/2006

Pages:19

File Size:1 file , 470 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.