IEC 60749-9 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

International Electrotechnical Commission , 04/12/2002

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 04/12/2002

Published:04/12/2002

Pages:9

File Size:1 file , 410 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive.