IEC 61188-5-4 Ed. 1.0 b:2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

International Electrotechnical Commission , 10/30/2007

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 10/30/2007

Published:10/30/2007

Pages:29

File Size:1 file , 920 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.