IEC 61189-3 Ed. 1.1 b:2006

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) CONSOLIDATED EDITION

International Electrotechnical Commission , 11/27/2006

Publisher: IEC

File Format: PDF

$100.00$201.00

Description

Standard By:International Electrotechnical Commission , 11/27/2006

Published:11/27/2006

Pages:141

File Size:1 file , 1 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. This consolidated version consists of the first edition (1997) and its amendment 1 (1999). Therefore, no need to order amendment in addition to this publication.